Wafer Bonding : Applications and Technology (Springer Series in Materials Science) <Vol.75>

Name: Wafer Bonding : Applications and Technology (Springer Series in Materials Science)
Brand: Springer
SKU: 00000_00000_00000_00000
Price: 2058.78 MYR
Availability: InStock

Alexe, Marin/ Goesele, Ulrich (Eds.)

2,058.78 MYR

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1,852.91

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Publisher

Springer

Publication Date

ISBN

9783540210498

Pages

372 illus./499

Item Type

Book

Format

Hardcover

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Wafer Bonding : Applications and Technology (Springer Series in Materials Science) <Vol.75>

Available to Order

Wafer Bonding : Applications and Technology (Springer Series in Materials Science) <Vol.75>

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