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Integrated Circuit Packaging, Assembly and Interconnections : Trends and Options (2007. XX, 280 p.)

Name: Integrated Circuit Packaging, Assembly and Interconnections : Trends and Options (2007. XX, 280 p.)
Brand: springer
SKU: 00000_00000_00000_00000
Price: 595.92 MYR
Availability: InStock

Greig, William J.

595.92 MYR

Member Price

536.33

English

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Product Description

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing.

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Publisher

springer

Publication Date

ISBN

9780387281537

Pages

320

Item Type

Book

Format

Hardcover

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Integrated Circuit Packaging, Assembly and Interconnections : Trends and Options (2007. XX, 280 p.)

Product Description

Available to Order

Integrated Circuit Packaging, Assembly and Interconnections : Trends and Options (2007. XX, 280 p.)

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