{"product_id":"9781402077623","title":"Advanced Wirebond Interconnection Technology (2004. 704 p.)","description":"\u003cp\u003eAdvanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor;\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Default Title","offer_id":52526909980983,"sku":"00000_00000_00000_00000","price":1945.06,"currency_code":"MYR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0962\/3548\/7543\/files\/9781402077623-1.jpg?v=1783194120","url":"https:\/\/kinokuniya.com.my\/products\/9781402077623","provider":"Books Kinokuniya Malaysia","version":"1.0","type":"link"}