{"product_id":"9780387281537","title":"Integrated Circuit Packaging, Assembly and Interconnections : Trends and Options (2007. XX, 280 p.)","description":"\u003cp\u003eReviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing.\u003c\/p\u003e","brand":"springer","offers":[{"title":"Default Title","offer_id":52529687757111,"sku":"00000_00000_00000_00000","price":595.92,"currency_code":"MYR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0962\/3548\/7543\/files\/9780387281537-1.jpg?v=1783108102","url":"https:\/\/kinokuniya.com.my\/products\/9780387281537","provider":"Books Kinokuniya Malaysia","version":"1.0","type":"link"}