{"product_id":"9780792376767","title":"Folded Flex and Thinned Silicon Chip Packaging Technology (Emerging Technology in Advanced Packaging Series, 1)","description":"\u003cp\u003eFoldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1\/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).\u003c\/p\u003e","brand":"Kluwer Academic Pub","offers":[{"title":"Default Title","offer_id":52271316107575,"sku":"00000_00000_00000_00000","price":921.0,"currency_code":"MYR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0962\/3548\/7543\/files\/9780792376767-1.jpg?v=1783125706","url":"https:\/\/kinokuniya.com.my\/ja\/products\/9780792376767","provider":"Books Kinokuniya Malaysia","version":"1.0","type":"link"}